Cyanate ester composites containing surface functionalized BN particles with grafted hyperpolyarylamide exhibiting desirable thermal conductivities and a low dielectric constant

Surface functionalized BN particles with grafted hyperbranched polyarylamide (BN-HBP) were prepared and used to improve the thermal conductivity and low dielectric constant of BN-filled cyanate ester resin (BN-HBP/CE) composites. The thermal stability, dielectric properties, thermal conductivity and dynamic mechanical properties of the BN-HBP/CE composites were investigated. The results illustrate that BN-HBP/CE composites with a load of 32 wt% exhibit a high glass transition temperature of 283 degrees C, low dielectric constant of 3.29 at 1 MHz, and a desirable thermal conductivity of 0.97 W/(m center dot K). Additionally, these novel materials exhibit a high decomposition temperature of 5% weight loss at 407 degrees C and low curing shrinkage of -0.64%. When the loading is 38 wt%, the thermal conductivity of BN-HBP/CE composites is 1.27 W/(m center dot K). These findings have significant implications for the preparation of high-performance substrates that meet the requirements for application as printed circuit board substrates.