Temperature-frequency-dependent mechanical properties model of epoxy resin and its composites

被引:66
作者
Feng, Jiemin [1 ]
Guo, Zhansheng [2 ]
机构
[1] Shanghai Univ, Dept Mech, Shanghai 200444, Peoples R China
[2] Shanghai Univ, Shanghai Inst Appl Math & Mech, Shanghai 200072, Peoples R China
关键词
Polymer-matrix composites (PMCs); Thermosetting resin; High-temperature properties; Analytical modelling; Dynamic mechanical thermal analysis;
D O I
10.1016/j.compositesb.2015.09.040
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Temperature-frequency-dependent dynamic mechanical properties of epoxy resin and glass/epoxy composites were studied at different loading modes by dynamic mechanical analysis. An improved temperature-dependent storage modulus model was developed to describe the storage modulus of the epoxy resin and glass/epoxy composites. A new and simple loss modulus model including two specific physical parameters was also developed. In addition, a model that can describe the temperature-frequency-dependent mechanical properties was established by combining the storage modulus model or loss modulus model with the Arrhenius equation. All of the model predictions showed very good agreements with the experimental results. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:161 / 169
页数:9
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