Effect of thermal activation energy on the structure and conductivity corrosion resistance of Cr doped TiN films on metal bipolar plate

被引：14

作者：

Yan, Fangyuan ^{[1
]}

Jiang, Bailing ^{[1
]}

Wang, Ziyu ^{[1
]}

Shi, Jing ^{[1
]}

机构：

[1] Xian Univ Technol, Sch Mat Sci & Engn, 5 South Jinhua Rd, Xian 710048, Shaanxi, Peoples R China

来源：

MATERIALS CHEMISTRY AND PHYSICS | 2022年 / 287卷

关键词：

Cr doped TiN film; Density; Magnetron sputtering; Electrical conductivity; Corrosion resistance; Metal bipolar plate; THIN-FILMS; BEHAVIOR; COATINGS;

D O I：

10.1016/j.matchemphys.2022.126082

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Cr doped TiN films were prepared on metal substrates via heating magnetron sputtering at different deposition temperatures (200 ?C-350 ?C). Vacuum thermal activation energy caused by heating obviously affect the microstructure, hydrophobicity, conductivity and corrosion resistance performance which were systematically investigated. The thickness of the Cr doped TiN films reduced from 573.1 nm to 487.5 nm with the elevating substrate temperature, increasing the films density and hydrophobicity. The maximum water contact Angle is 115.86? and minimum interfacial contact resistance (ICR) is 3.62 m omega cm2 at 350 ?C of which the electrical conductivity completely satisfy with the DOE target (< 10 m omega cm(2)), indicating a potential application of Cr doped TiN films on stainless steel (SS) for metal bipolar plate.

引用

页数：10

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