Experimental Investigation on Brittle-ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

被引：8

作者：

Gao, Yufei ^{[1
]}

Ge, Peiqi ^{[1
]}

机构：

[1] Shandong Univ, Sch Mech Engn, Jinan 250061, Peoples R China

来源：

MACHINING AND ADVANCED MANUFACTURING TECHNOLOGY X | 2010年 / 431-432卷

关键词：

Single crystal silicon; Wire saw; Brittle-ductile transition; Partial ductile mode; MECHANISM;

D O I：

10.4028/www.scientific.net/KEM.431-432.265

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.

引用

页码：265 / 268

页数：4

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