Thermal Field Study of Multichip LED Module

To date, LED was often manufactured as a multi-package module instead of as a single package keeping in mind the luminosity demand and cost concerns. Nevertheless, the uniformity of the temperature gradient may generate an unbalanced stress along the multi-package interface, resulting in lifespan and output degradation. It is hence obligatory to predict and model the thermal transfer performance of the LED module prior to the manufacturing process so as to ensure output quality and to prevent catastrophic failure.