Abnormal Recovery Phenomenon Induced by Hole Injection During Hot Carrier Degradation in SOI n-MOSFETs

被引:3
作者
Lu, Ying-Hsin [1 ]
Chang, Ting-Chang [2 ,3 ,4 ]
Chen, Li-Hui [5 ]
Lin, Yu-Shan [1 ]
Liu, Xi-Wen [1 ]
Liao, Jih-Chien [6 ]
Lin, Chien-Yu [5 ]
Lien, Chen-Hsin [6 ]
Chang, Kuan-Chang [7 ]
Zhang, Sheng-Dong [7 ]
机构
[1] Natl Sun Yat Sen Univ, Dept Phys, Kaohsiung 80424, Taiwan
[2] Natl Sun Yat Sen Univ, Dept Phys, Kaohsiung 804, Taiwan
[3] Natl Cheng Kung Univ, Adv Optoelect Technol Ctr, Tainan 701, Taiwan
[4] Natl Sun Yat Sen Univ, Dept Photon, Kaohsiung 804, Taiwan
[5] Natl Sun Yat Sen Univ, Dept Photon, Kaohsiung 80424, Taiwan
[6] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 30013, Taiwan
[7] Peking Univ, Dept Elect & Comp Engn, Shenzhen 518055, Peoples R China
关键词
Hole injection; hot carrier; impact ionization; abnormal recovery; P-MOSFETS; OXIDE;
D O I
10.1109/LED.2017.2703309
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter investigates an abnormal recovery phenomenon induced by hole injection during hot carrier degradation in silicon-on-insulator n-typemetal-oxide-semiconductor transistors. The method by which the hole injection induces the abnormal recovery behavior can be clarified by different hot carrier degradation (HCD) measurement sequences. According to this HCD result, the channel surface energy band is drawn down and the interface defect will be temporarily shielded, an effect caused by the trapped hole. Furthermore, results of different stress voltage experiments indicate that the amount of hole injection is determined by the electric field between the gate and drain.
引用
收藏
页码:835 / 838
页数:4
相关论文
共 13 条
[1]   Linearity and low-noise performance of SOI MOSFETs for RF applications [J].
Adan, AO ;
Yoshimasu, T ;
Shitara, S ;
Tanba, N ;
Fukumi, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2002, 49 (05) :881-888
[2]   Gate-induced floating-body effect in fully-depleted SOI MOSFETs with tunneling oxide and back-gate biasing [J].
Cassé, M ;
Pretet, J ;
Cristoloveanu, S ;
Poiroux, T ;
Fenouillet-Beranger, C ;
Fruleux, F ;
Raynaud, C ;
Reimbold, G .
SOLID-STATE ELECTRONICS, 2004, 48 (07) :1243-1247
[3]   Controlling short-channel effects in deep-submicron SOI MOSFETs for improved reliability: A review [J].
Chaudhry, A ;
Kumar, MJ .
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2004, 4 (01) :99-109
[4]   On the Origin of Gate-Induced Floating-Body Effect in PD SOI p-MOSFETs [J].
Dai, Chih-Hao ;
Chang, Ting-Chang ;
Chu, An-Kuo ;
Kuo, Yuan-Jui ;
Jian, Fu-Yen ;
Lo, Wen-Hung ;
Ho, Szu-Han ;
Chen, Ching-En ;
Chung, Wan-Lin ;
Shih, Jou-Miao ;
Xia, Guangrui ;
Cheng, Osbert ;
Huang, Cheng-Tung .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (07) :847-849
[5]   HOT-ELECTRON-INDUCED MOSFET DEGRADATION - MODEL, MONITOR, AND IMPROVEMENT [J].
HU, CM ;
TAM, SC ;
HSU, FC ;
KO, PK ;
CHAN, TY ;
TERRILL, KW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (02) :375-385
[6]  
Jaju V., 2004, ADV MOSFETS, VEE 530, P1
[7]   The Impact of Pre/Post-metal Deposition Annealing on Negative-Bias-Temperature Instability in HfO2 Stack p-Channel Metal-Oxide-Semiconductor Field Effect Transistors [J].
Lu, Ying-Hsin ;
Chang, Ting-Chang ;
Ho, Szu-Han ;
Chen, Ching-En ;
Tsai, Jyun-Yu ;
Liu, Kuan-Ju ;
Liu, Xi-Wen ;
Tseng, Tseung-Yuen ;
Cheng, Osbert ;
Huang, Cheng-Tung ;
Lu, Ching-Sen .
ECS SOLID STATE LETTERS, 2015, 4 (08) :Q37-Q39
[8]  
Mahapatra S, 2007, INT RELIAB PHY SYM, P1
[9]   RECOVERY OF THRESHOLD VOLTAGE AFTER HOT-CARRIER STRESSING [J].
ONG, TC ;
LEVI, M ;
KO, PK ;
HU, CM .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1988, 35 (07) :978-984
[10]   MEASUREMENT AND MODELING OF SELF-HEATING IN SOI NMOSFETS [J].
SU, LT ;
CHUNG, JE ;
ANTONIADIS, DA ;
GOODSON, KE ;
FLIK, MI .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1994, 41 (01) :69-75