Tensile, hardness and microstructural properties of Sn-Pb solder alloys

被引：28

作者：

Adetunji, Olayide R. ^{[1
]}

Ashimolowo, Ridwan A. ^{[1
]}

Aiyedun, Peter O. ^{[1
]}

Adesusi, Olanrewaju M. ^{[1
]}

Adeyemi, Hezekiah O. ^{[2
]}

Oloyede, Olamilekan R. ^{[3
]}

机构：

[1] Fed Univ Agr, Coll Engn, Mech Engn Dept, PMB 2240, Abeokuta, Ogun State, Nigeria

[2] Olabisi Onabanjo Univ, Mech Engn Dept, Ibogun Campus, Ago Iwoye, Ogun State, Nigeria

[3] Afe Babalola Univ, Mech Engn Dept, Ado Ekiti, Ekiti State, Nigeria

来源：

MATERIALS TODAY-PROCEEDINGS | 2021年 / 44卷

关键词：

Tensile; Hardness; SEM; Sn-Pb alloy; Solder;

D O I：

10.1016/j.matpr.2020.09.656

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This work investigated the Tensile, Hardness and Microstructural Properties of Sn-Pb Solder Alloys of Pb content 15, 60 and 80%. The Sn-Pb solder alloy was prepared from granulated Sn and Pb. The element was mixed in right proportions, melted in furnace at 350 ?C while being held in crucible. The results showed that maximum tensile stresses obtained had specimen containing 60% with the highest value and the alloys had decreased hardness as a result of increased Pb content while ductility of the alloy increased as observed from stress strain curve. The sample alloy with 60% Pb is the preferred solder. ? 2021 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the International Conference on Materials, Processing & Characterization.

引用

页码：321 / 325

页数：5

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