Silicone oil contamination and electrical contact resistance degradation of low-force gold contacts

被引：12

作者：

Dickrell, Daniel J., III ^{[1
]}

Dugger, Michael T.

机构：

[1] Univ Florida, Dept Mech & Aerosp Engn, Gainesville, FL 32611 USA

[2] Sandia Natl Labs, Microsyst Mat Dept, Albuquerque, NM 87185 USA

来源：

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 2007年 / 16卷 / 01期

关键词：

contact resistance; microelectromechanical systems (MEMS); silicones; surface contamination;

D O I：

10.1109/JMEMS.2006.885984

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Hot-switched low-force gold electrical contact testing was performed using a nanomechanical test apparatus to ascertain the sensitivity of simulated microelectromechanical systems (MEMS) contact to silicone oil contamination. The observed cyclic contact resistance degradation was dependent on both closure rate and noncontact applied voltage. The decomposition of silicone oil from electrical arcing was hypothesized as the degradation mechanism.

引用

页码：24 / 28

页数：5

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