Identification of non uniform thermal contact resistance in automated tape placement process

被引：18

作者：

Barasinski, Anais ^{[1
]}

Leygue, Adrien ^{[1
]}

Soccard, Eric ^{[2
]}

Poitou, Arnaud ^{[1
]}

机构：

[1] Ecole Cent Nantes, GeM Inst, F-44321 Nantes 3, France

[2] EADS IW, F-44300 Bouguenais, France

来源：

INTERNATIONAL JOURNAL OF MATERIAL FORMING | 2014年 / 7卷 / 04期

关键词：

Automated tape placement; Thermal contact resistance; Thermal modeling; Thermoplastic composite material; CRYSTALLIZATION;

D O I：

10.1007/s12289-013-1144-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this work focussing on the thermal modeling of the automated tape placement process applied to thermoplastic material, we study the thermal properties of the ply interfaces during in-situ consolidation. Through the comparison of experimental measurements and numerical simulations, we show that it is necessary to consider the existence of an interply thermal contact resistance (TCR). Furthermore, we show that in order to correctly predict the measured temperatures, the value of the thermal resistance has to evolve along the process although a very simple evolution law is sufficient.

引用

页码：479 / 486

页数：8

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