Vibration reliability characterization of PBGA assemblies

被引：50
作者：
Yang, QJ
Pang, HLJ
Wang, ZP
Lim, GH
Yap, FF
Lin, RM
机构：
[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
[2] Gintic Inst Mfg Technol, Singapore 638075, Singapore
来源：
MICROELECTRONICS RELIABILITY | 2000年 / 40卷 / 07期
关键词：
This work was funded by the Gintic Institute of Manufacturing Technology Upstream Research Project: U96-T-169. The authors are truly grateful for the financial support and technical assistance provided by the Gintic Institute of Manufacturing Technology;
D O I：
10.1016/S0026-2714(00)00036-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Generally, the low-cycle fatigue induced by thermal cycling is the major concern in the reliability of surface mount technology for electronic packaging, but the high-cycle fatigue induced by vibration can also contribute significant effect, especially for applications in automobile, military, and avionic industries. To assess vibration induced fatigue failures, the dynamic properties of printed circuit board (PCB) assemblies play a very important role. In this paper, the dynamic properties of a plastic ball grid array (PBGA) assembly were characterized by using experimental modal testing and finite element analysis. The bare PCB and PCB assembly with PBGA modules mounted were tested and analyzed separately, so that the influence of PBGA modules on the PCB's dynamic properties could be identified. It was found that mounting PBGA modules to PCB increased the stiffness of the PCB. Results of constant-amplitude vibration reliability testing of the PBGA assembly are also reported. It was found that the PBGA assembly was vulnerable to vibration, and fatigue failure always occurred at the corner solder balls of the PBGA module. (C) 2000 Elsevier Science Ltd. All rights reserved.
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页码：1097 / 1107
页数：11
相关论文
共 15 条
[1]  
Allemang R.J., 1982, P INT MODAL ANAL C, P110
[2]  
Barker D. B., 1993, Transactions of the ASME. Journal of Electronic Packaging, V115, P195, DOI 10.1115/1.2909317
[3]  
Barker D. B., 1993, Transactions of the ASME. Journal of Electronic Packaging, V115, P189, DOI 10.1115/1.2909316
[4]  
Lau J., 1993, Transactions of the ASME. Journal of Electronic Packaging, V115, P180, DOI 10.1115/1.2909315
[5]  
LIGUORE S, 1992, 92WAEEP25 ASME
[6]  
McMurray K. E., 1997, Advances in Electronic Packaging 1997. Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference. INTERpack '97, P1321
[7]  
Pitarresi J. M., 1993, Advances in Electronic Packaging 1993. Proceedings of the 1993 ASME International Electronics Packaging Conference, P207
[8]  
PITARRESI JM, 1991, J ELECTRON PACKAGING, V115, P250
[9]  
PITARRESI JM, 1990, IEEE INT S CIRC SYS, V3, P2104
[10]  
ROBERTS JC, 1991, J IES, V34, P25
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