Heterogeneous Integration Roadmap

被引：0

作者：

Chen, William ^{[1
]}

Bottoms, W. R. ^{[2
]}

机构：

[1] ASE Grp, Sunnyvale, CA 94085 USA

[2] 3MTS, Palo Alto, CA USA

来源：

2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2017年

关键词：

Heterogeneous; Roadmap; SIP; HIR;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes the background, purpose, mission, scope and schedule of the Heterogeneous Integration Roadmap. With the electronics industry entering an era of acceleration and disruption, the role of Heterogeneous Integration will prove very important in response to the driving forces of IoT, Data Centers, Smart Mobile and Intelligent Automotive. It addresses the future vision for hardware challenges and for innovation with strong focus for Heterogeneous Integration. The goal for the Heterogeneous Integration Roadmap is to be of service to the Profession, Industry, Academia, and Research Institutes.

引用

页码：302 / 305

页数：4