Impact of GaN cap on charges in Al2O3/(GaN/)AlGaN/GaN metal-oxide-semiconductor heterostructures analyzed by means of capacitance measurements and simulations

被引:53
作者
Tapajna, M. [1 ]
Jurkovic, M. [1 ]
Valik, L. [1 ]
Hascik, S. [1 ]
Gregusova, D. [1 ]
Brunner, F. [2 ]
Cho, E. -M. [2 ]
Hashizume, T. [3 ,4 ]
Kuzmik, J. [1 ]
机构
[1] Slovak Acad Sci, Inst Elect Engn, Bratislava 84104, Slovakia
[2] Ferdinand Braun Inst, Leibniz Inst Hochstfrequenztech, D-12489 Berlin, Germany
[3] Hokkaido Univ, RCIQE, Sapporo, Hokkaido 0600814, Japan
[4] JST CREST, Tokyo 1020075, Japan
关键词
ELECTRICAL-PROPERTIES; SURFACES; HFETS;
D O I
10.1063/1.4894703
中图分类号
O59 [应用物理学];
学科分类号
摘要
Oxide/semiconductor interface trap density (D-it) and net charge of Al2O3/(GaN)/AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistor (MOS-HEMT) structures with and without GaN cap were comparatively analyzed using comprehensive capacitance measurements and simulations. D-it distribution was determined in full band gap of the barrier using combination of three complementary capacitance techniques. A remarkably higher D-it (similar to 5-8 X 10(12) eV(-1) cm(-2)) was found at trap energies ranging from E-C-0.5 to 1 eV for structure with GaN cap compared to that (D-it similar to 2-3 X 10(12) eV(-1) cm(-2)) where the GaN cap was selectively etched away. D-it distributions were then used for simulation of capacitance-voltage characteristics. A good agreement between experimental and simulated capacitance-voltage characteristics affected by interface traps suggests (i) that very high D-it (>10(13) eV(-1) cm(-2)) close to the barrier conduction band edge hampers accumulation of free electron in the barrier layer and (ii) the higher D-it centered about E-C-0.6 eV can solely account for the increased C-V hysteresis observed for MOS-HEMT structure with GaN cap. Analysis of the threshold voltage dependence on Al2O3 thickness for both MOS-HEMT structures suggests that (i) positive charge, which compensates the surface polarization, is not necessarily formed during the growth of III-N heterostructure, and (ii) its density is similar to the total surface polarization charge of the GaN/AlGaN barrier, rather than surface polarization of the top GaN layer only. Some constraints for the positive surface compensating charge are discussed. (C) 2014 AIP Publishing LLC.
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页数:7
相关论文
共 35 条
[1]   InAlN/GaN MOSHEMT With Self-Aligned Thermally Generated Oxide Recess [J].
Alomari, M. ;
Medjdoub, F. ;
Carlin, J. -F. ;
Feltin, E. ;
Grandjean, N. ;
Chuvilin, A. ;
Kaiser, U. ;
Gaquiere, C. ;
Kohn, E. .
IEEE ELECTRON DEVICE LETTERS, 2009, 30 (11) :1131-1133
[2]  
[Anonymous], THESIS U CALIFORNIA
[3]   Impact of carbon and nitrogen impurities in high-κ dielectrics on metal-oxide-semiconductor devices [J].
Choi, Minseok ;
Lyons, John L. ;
Janotti, Anderson ;
Van de Walle, Chris G. .
APPLIED PHYSICS LETTERS, 2013, 102 (14)
[4]   Native point defects and dangling bonds in α-Al2O3 [J].
Choi, Minseok ;
Janotti, Anderson ;
Van de Walle, Chris G. .
JOURNAL OF APPLIED PHYSICS, 2013, 113 (04)
[5]   Influence of processing and annealing steps on electrical properties of InAlN/GaN high electron mobility transistor with Al2O3 gate insulation and passivation [J].
Cico, K. ;
Gregusova, D. ;
Kuzmik, J. ;
Jurkovic, M. ;
Alexewicz, A. ;
Poisson, M. -A. di Forte ;
Pogany, D. ;
Strasser, G. ;
Delage, S. ;
Froehlich, K. .
SOLID-STATE ELECTRONICS, 2012, 67 (01) :74-78
[6]   High-Speed AlN/GaN MOS-HFETs With Scaled ALD Al2O3 Gate Insulators [J].
Corrion, A. L. ;
Shinohara, K. ;
Regan, D. ;
Milosavljevic, I. ;
Hashimoto, P. ;
Willadsen, P. J. ;
Schmitz, A. ;
Kim, S. J. ;
Butler, C. M. ;
Brown, D. ;
Burnham, S. D. ;
Micovic, M. .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (08) :1062-1064
[7]   Electrical properties of atomic layer deposited aluminum oxide on gallium nitride [J].
Esposto, Michele ;
Krishnamoorthy, Sriram ;
Nath, Digbijoy N. ;
Bajaj, Sanyam ;
Hung, Ting-Hsiang ;
Rajan, Siddharth .
APPLIED PHYSICS LETTERS, 2011, 99 (13)
[8]   Investigation of the interface between silicon nitride passivations and AlGaN/AlN/GaN heterostructures by C(V) characterization of metal-insulator-semiconductor-heterostructure capacitors [J].
Fagerlind, M. ;
Allerstam, F. ;
Sveinbjornsson, E. O. ;
Rorsman, N. ;
Kakanakova-Georgieva, A. ;
Lundskog, A. ;
Forsberg, U. ;
Janzen, E. .
JOURNAL OF APPLIED PHYSICS, 2010, 108 (01)
[9]   Presence and origin of interface charges at atomic-layer deposited Al2O3/III-nitride heterojunctions [J].
Ganguly, Satyaki ;
Verma, Jai ;
Li, Guowang ;
Zimmermann, Tom ;
Xing, Huili ;
Jena, Debdeep .
APPLIED PHYSICS LETTERS, 2011, 99 (19)
[10]   Adjustment of threshold voltage in AlN/AlGaN/GaN high-electron mobility transistors by plasma oxidation and Al2O3 atomic layer deposition overgrowth [J].
Gregusova, D. ;
Jurkovic, M. ;
Hascik, S. ;
Blaho, M. ;
Seifertova, A. ;
Fedor, J. ;
Tapajna, M. ;
Froehlich, K. ;
Vogrincic, P. ;
Liday, J. ;
Derluyn, J. ;
Germain, M. ;
Kuzmik, J. .
APPLIED PHYSICS LETTERS, 2014, 104 (01)