Investigation on surface morphological and optical properties of black silicon fabricated by metal-assisted chemical etching with different etchant concentrations
被引:2
作者:
Noor, N. A. M.
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h-index: 0
机构:
Univ Sains Malaysia, Sch Phys, Nanooptoelect Res & Technol Lab, George Town 11800, MalaysiaUniv Sains Malaysia, Sch Phys, Nanooptoelect Res & Technol Lab, George Town 11800, Malaysia
Noor, N. A. M.
[1
]
Pakhuruddin, M. Z.
论文数: 0引用数: 0
h-index: 0
机构:
Univ Sains Malaysia, Sch Phys, Nanooptoelect Res & Technol Lab, George Town 11800, MalaysiaUniv Sains Malaysia, Sch Phys, Nanooptoelect Res & Technol Lab, George Town 11800, Malaysia
Pakhuruddin, M. Z.
[1
]
机构:
[1] Univ Sains Malaysia, Sch Phys, Nanooptoelect Res & Technol Lab, George Town 11800, Malaysia
来源:
INTERNATIONAL CONFERENCE ON SUSTAINABLE ENERGY AND GREEN TECHNOLOGY 2018
|
2019年
/
268卷
关键词:
SOLAR-CELLS;
PASSIVATION;
D O I:
10.1088/1755-1315/268/1/012064
中图分类号:
X [环境科学、安全科学];
学科分类号:
08 ;
0830 ;
摘要:
In this study, the surface morphological and optical properties of black silicon (b-Si) fabricated by two-step metal-assisted chemical etching (MACE) process are investigated. The two-step MACE combines low-temperature annealing of silver (Ag) thin film to produce Ag nanoparticles (NPs) and short etching duration of crystalline silicon (c-Si) wafer. The etching is carried out in HF:H2O2:DI H2O solution for 70 s with different etchant concentrations (represented in the form of volume ratio). The MACE process produces b-Si nanopores on the wafer. Compared with planar c-Si reference, broadband reflection (in 300-1100 nm wavelength region) of the b-Si is significantly lower. B-Si wafer with volume ratio of 1:5:10 exhibits the lowest broadband reflection of 3% at wavelength of 600 nm, which is believed to be due to refractive index grading which leads to enhanced light coupling into the b-Si wafer. The best b-Si wafer (with lowest reflection) shows 50 nm average pillar width and 300 nm height. The increased broadband light absorption results in the highest maximum potential short-circuit current density (J(sc(max))) of 40.9 mA/cm(2). This represents 55.4% enhancement, if compared with the planar c-Si reference wafer, assuming unity carrier collection.