High-speed receivers for on-chip interconnections in deep-submicron process

被引:0
|
作者
Huang, HY [1 ]
Chen, SL [1 ]
机构
[1] Fu Jen Catholic Univ, Dept Elect Engn, VLSI CAD Lab, Taipei, Taiwan
关键词
D O I
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中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The transient sensitive trigger (TST) was used to improve the RC delay time of the long interconnection in deep sub-micron process. The conventional TST circuit has a threshold voltage drop during the transitions which results in a longer delay time. In this work, the modified techniques are proposed to improve the drawback of the conventional TST. The new versions have 45-74% delay improvement compared to the conventional TST simulated using a 0.25mum CMOS process. The proposed circuits can be applied to the receiving of long interconnection signal for the applications of high-speed VLSI.
引用
收藏
页码:769 / 772
页数:4
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