A very compact 62-GHz transmitter LTCC SiP module for wireless terminals applications

被引：12
作者：
Lee, Young Chul
Park, Chul Soon
机构：
[1] Mokpo Natl Maritime Univ, Div Marine Elect & Commun Engn, Mokpo 530729, South Korea
[2] Informat & Commun Univ, Sch Engn, Taejon 305732, South Korea
来源：
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2007年 / 49卷 / 03期
关键词：
LTCC; SiP; transmitter; 60; GHz;
D O I：
10.1002/mop.22211
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A 10 X 21 X I nuns very compact low temperature cofired ceramic (LTCC) system-in-package (SiP) transmitter module is presented for future wireless terminal applications. Five GaAs monolithic microwave integrated circuits (MMIC) chipsets including a power amplifier, driver amplifier, mixer, and two frequency multipliers are integrated into a LTCC multilayer circuit for the heterodyne transmitter. The fabricated transmitter module achieves an output of 13 dBm at a RF frequency of 62 GHz, an IF frequency of 2.4 GHz, and an local oscillator frequency of 59.6 GHz. The up-conversion gain is I I dB; while the local oscillator Signal is suppressed below -20.6 dBc with the image rejection mixer, and the image and spurious signals are also suppressed below -29.6 dBc. (c) 2007 Wiley Periodicals, Inc.
引用
收藏
页码：575 / 578
页数：4
相关论文
共 10 条
[1]  
Beilenhoff K, 1997, IEEE MTT-S, P1789, DOI 10.1109/MWSYM.1997.596891
[2]  
BORNHOLDT C, 2002, IEEE OPT FIB COMM C, P148
[3]   On the design of coplanar bond wires as transmission lines [J].
Goossen, KW .
IEEE MICROWAVE AND GUIDED WAVE LETTERS, 1999, 9 (12) :511-513
[4]   On the use of vias in conductor-backed coplanar circuits [J].
Haydl, WH .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2002, 50 (06) :1571-1577
[5]   MODE CONVERSION AT DISCONTINUITIES IN FINITE-WIDTH CONDUCTOR-BACKED COPLANAR WAVE-GUIDE [J].
JACKSON, RW .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1989, 37 (10) :1582-1589
[6]  
Krems T., 1995, Electrical Performance of Electronic Packaging (Cat. No.95TH8137), P178, DOI 10.1109/EPEP.1995.524887
[7]  
KREMS T, 1998, IEEE MTT S INT MICR, V3, P109
[8]  
Ohata K, 2003, IEEE MTT S INT MICR, P373, DOI 10.1109/MWSYM.2003.1210955
[9]  
Vaios A, 2003, LECT NOTES COMPUT SC, V2775, P219
[10]  
Yamada A, 2003, IEEE MTT S INT MICR, P2035, DOI 10.1109/MWSYM.2003.1210560
1