Technology challenges for communications systems chips

被引：0

作者：

Pinto, MR ^{[1
]}

机构：

[1] Lucent Technol Microelect Grp, Allentown, PA 18103 USA

来源：

PROCEEDINGS OF THE IEEE 2000 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2000年

关键词：

D O I：

10.1109/IITC.2000.854079

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In the era of 0.25um and finer feature sizes, the IC industry has seen the advent of true systems chips (SoCs) where traditionally disparate functions - e.g. processors, logic, programmable elements, analog, RF, memory - are integrated monolithically to perform an applications level task. In addition to traditional VLSI scaling issues, SoCs present many special and sometimes unique technology challenges. This contribution focuses on those related to process technologies with a special focus on communications applications arguably the new driver of the IC industry.

引用

页码：I / III

页数：3

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