Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

被引：309

作者：

Hou, Jun ^{[1
]}

Li, Guohua ^{[1
]}

Yang, Na ^{[1
]}

Qin, Lili ^{[1
]}

Grami, Maryam E. ^{[2
]}

Zhang, Qingxin ^{[1
]}

Wang, Nongyue ^{[1
]}

Qu, Xiongwei ^{[1
]}

机构：

[1] Hebei Univ Technol, Inst Polymer Sci & Engn, Sch Chem Engn, Tianjin 300130, Peoples R China

[2] Winona State Univ, Winona, MN 55987 USA

来源：

RSC ADVANCES | 2014年 / 4卷 / 83期

关键词：

POLYMER COMPOSITES; FUNCTIONALIZATION; NANOSHEETS; PERFORMANCE; NANOTUBES; POLYIMIDE; ALUMINA; FILLERS; HYBRID; MICRO;

D O I：

10.1039/c4ra07394k

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Hexagonal boron nitride (h-BN) microparticles, modified by surface coupling agent 3-aminopropyl triethoxy silane (APTES), were used to fabricate thermally conductive epoxy/BN composites, and the effects of modified-BN content on the thermal and insulating properties were investigated. It was found that incorporation of h-BN particles in the epoxy matrix significantly enhanced the thermal conductivity of the composites. With 30 wt% modified-BN loading, the thermal conductivity of the composites was 1.178 W m(-1) K-1, 6.14 times higher than that of the neat epoxy. Fabricated epoxy/BN composites exhibited improved thermal stability, storage modulus, and glass transition temperature with increased BN content. The composites also possessed excellent electrical insulation properties. These results revealed that epoxy/BN composites are promising as efficient heat-releasing materials for thermal management and microelectronic encapsulation.

引用

页码：44282 / 44290

页数：9

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