A brief review of selected aspects of the materials science of ball bonding

被引：83

作者：

Breach, C. D. ^{[1
]}

Wulff, F. W. ^{[2
]}

机构：

[1] ProMat Consultants, Singapore 789094, Singapore

[2] WC Heraeus GmbH Hanau, Contact Mat Div, Business Unit Bonding Wires, D-63450 Hanau, Germany

来源：

MICROELECTRONICS RELIABILITY | 2010年 / 50卷 / 01期

关键词：

STACKING-FAULT ENERGY; CU WIRE-BONDS; INTERMETALLIC GROWTH; GOLD-WIRE; ROOM-TEMPERATURE; COPPER-ALUMINUM; PHASE-TRANSFORMATIONS; INTERFACIAL REACTIONS; IN-DIFFUSION; AL;

D O I：

10.1016/j.microrel.2009.08.003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball-wedge bonding in an attempt to better control and advance its application as an interconnect technology in advanced packaging. As with most materials processes, establishing a scientific understanding of the process requires knowledge from various sub-disciplines of physical science. This article briefly reviews selected aspects of the materials science of ball bonding, focussing on 1st and 2nd bond formation and intermetallic growth. (C) 2009 Elsevier Ltd. All rights reserved.

引用

页码：1 / 20

页数：20

共 155 条

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