Microstructural and thermal property evolution of reaction bonded silicon carbide (RBSC)

被引:22
作者
Zhang, Yuying [1 ]
Hsu, Chun-Yen [1 ]
Aubuchon, Steven [1 ,2 ]
Karandikar, Prashant [1 ,3 ]
Ni, Chaoying [1 ]
机构
[1] Univ Delaware, Mat Sci & Engn, Newark, DE 19716 USA
[2] TA Instruments, 159 Lukens Dr, New Castle, DE 19720 USA
[3] M Cubed Technol Inc, 1 Tralee Ind Pk, Newark, DE 19711 USA
关键词
Reaction bonding; SiC; Thermal conductivity; Phase transformation; Annealing; In-situ TEM; AMORPHOUS-SILICON; HIGH-TEMPERATURES; CONDUCTIVITY; EXPANSION; CERAMICS; CRYSTALS;
D O I
10.1016/j.jallcom.2018.05.321
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Temperature dependent thermal conductivity of reaction bonded silicon carbide (RBSC) from 300 K to 1073 K is evaluated. The thermal conductivity of 80 vol% and 90 vol% SiC RBSC is measured to be 185.7 W/m . K and 211.4 W/m . K at room temperature and decreases to 51.46 W/m . K and 55.77 W/m . K at 1073 K, respectively. Thermal transport behavior of RBSC at elevated temperatures suggests that a structural mechanism plausibly associated with phase transformation occurs in the composite system. TEM in-situ heating test is employed to investigate the RBSC phase evolution. Results indicate the existence of minor Si amorphous phase near SiC/Si interface, and the amorphous Si phase transformation to crystalline Si could start at a relatively low temperature. The Si phase transformation improves the thermal transport performance of the RBSC system. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码:107 / 111
页数:5
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