Complete front-to-back RF SiP design implementation flow

被引：5

作者：

Park, John ^{[1
]}

Hartung, Juergen ^{[1
]}

Dudek, Heiko ^{[1
]}

机构：

[1] Cadence Design Syst Inc, 363 Centennial Parkway, Louisville, CO 80027 USA

来源：

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS | 2007年

关键词：

D O I：

10.1109/ECTC.2007.373917

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

RF SiP is an integration and implementation fabric based on a single package substrate that allows the integration of digital ICs, logic IC, and RF ICs plus passive components, SAW filters, and mechanical parts. But RF SiP technology is constrained by the fact that, today, SiP design is an "expert engineering" process-one that is not scalable as a general design solution. To facilitate a move to mainstream SiP implementation, an integrated, scalable SiP design solution with reference flows must be provided. The new solution will involve a change in design methodology for SiP products, but also addresses the need for an improved design chain collaboration. The paper will describe the various implementations steps focusing on the underlying methodology to address the challenges around RF SiP design and how to ensure a proper hand-over between the design domains within a company or to an external supplier.

引用

页码：986 / +

页数：2