On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array

被引：15

作者：

Kattan, Hammam ^{[1
]}

Chung, Sung Woo ^{[2
]}

Henkel, Joerg ^{[3
]}

Amrouch, Hussam ^{[4
]}

机构：

[1] Karlsruhe Inst Technol, Chair Embedded Syst CES, D-76131 Karlsruhe, Germany

[2] Korea Univ, Dept Comp Sci, Seoul 136713, South Korea

[3] Karlsruhe Inst Technol, Embedded Syst, D-76131 Karlsruhe, Germany

[4] Univ Stuttgart, Elect Engn Fac, Semicond Test & Reliabil STAR Chair Comp Sci, D-70174 Stuttgart, Germany

来源：

IEEE MICRO | 2021年 / 41卷 / 04期

关键词：

Energy harvesting; Mobile devices; Thermal management; Thermoelectric;

D O I：

10.1109/MM.2021.3061335

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

On-demand cooling is inevitable to maximize the processor's performance, while fulfilling thermal constraints-this holds more in advanced technologies, where localized hotspots change during runtime. In this work, we propose to adopt an array of thin-film thermoelectric (TE) devices, which is integrated within the chip packaging, for both cooling and energy-harvesting purposes. Each TE device within the array can be during the runtime enabled either for energy harvesting or on-demand cooling. Our approach is implemented and evaluated using a mature finite elements analysis tool in which a commercial multicore mobile chip is modeled after careful calibrations together with state-of-the-art TE devices. Results demonstrate that our approach reduces the peak temperature by up to 24 degrees C and the average temperature by 10 degrees C across various benchmarks with the cost of 67.5 mW. Additionally, the harvested energy from the array of TE devices compensates for 89% of the required cooling energy.

引用

页码：67 / 73

页数：7

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