Work of adhesion and orientation relationships at the solid Cu/Al2O3 interface

被引:9
|
作者
Soper, A
Gilles, B
Eustathopoulos, N
机构
来源
INTERGRANULAR AND INTERPHASE BOUNDARIES IN MATERIALS, PT 2 | 1996年 / 207-卷
关键词
wettability interfacial energy; preferred orientations; work of adhesion;
D O I
10.4028/www.scientific.net/MSF.207-209.433
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study examines both work of adhesion and preferred interfacial orientations at the solid-state Cu/Al2O3 interface. Low energy orientation relationships and solid wettability have been determined experimentally for Cu particles equilibrated on two types of oriented Al2O3 substrate, (0001) and (<1(1)over bar 02>), for various times and temperatures (800 degrees C to 1040 degrees C).
引用
收藏
页码:433 / 436
页数:4
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