Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips

被引：0

作者：

Liu, S. T. ^{[1
]}

Zhang, Y. C. ^{[1
]}

机构：

[1] Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China

来源：

CURRENT DEVELOPMENT IN ABRASIVE TECHNOLOGY, PROCEEDINGS | 2006年

关键词：

microchannel; heat sink; fractal;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, the improved design of fractal branching channel net that can meet the demand for cooling of rectangular electronic chip with arbitrary ratio of length to width is presented. A theory model is proposed that estimate performance of heat transfer and pressure drop approximately. It is found that the optimal total branching level is 7 and the ratio of length to width is 1.87 at the fixed cooling surface for fractal microchannel heat sink.

引用

页码：331 / +

页数：2

共 11 条

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