Theoretical explorations of structure, mechanical properties, fracture toughness, electronic properties, and thermal conductivity of Ag-doped η′-Cu6Sn5

被引:36
作者
Yang, Ancang [1 ]
Duan, Yonghua [1 ]
Li, Caiju [1 ]
Yi, Jianhong [1 ]
Peng, Mingjun [1 ]
机构
[1] Kunming Univ Sci & Technol, Fac Mat Sci & Engn, Kunming 650093, Yunnan, Peoples R China
关键词
First-principles calculations; Cu6Sn5; Elastic properties; Fracture toughness; Thermal conductivity; LEAD-FREE SOLDERS; PB-FREE SOLDER; PHASE-STABILITY; ELASTIC PROPERTIES; CU; MICROSTRUCTURE; NI; INTERMETALLICS; HARDNESS; TEMPERATURE;
D O I
10.1016/j.intermet.2021.107437
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In this work, the phase stability, elasticity, fracture toughness, electronic characteristics and thermal conductivity of Ag-doped eta'-Cu6Sn5 were explored based on the first-principles calculations. Herein, four Cu doping sites and three Sn doping sites were considered based on the crystal structure of eta'-Cu6Sn5. The calculated results show that the doping of Ag can enhance the stability, change the elastic properties, and increase the ductility of eta'-Cu6Sn5. Moreover, Ag doping changes the elastic anisotropy in different directions. Besides, Ag doping improves the fracture toughness and thermal conductivity of eta'-Cu6Sn5, and enhances the strength of covalent bonds in the structure.
引用
收藏
页数:12
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