The study of inorganic alignment technique and rework process on 65" LCoS RPTV

There are evaporating angle, particle contamination and film uniformity issue in the inorganic alignment film manufacturing process. Rework technique of alignment film is the only solution to reuse wafer and ITO glass. Dry etching process is used because of its cheaper, simplicity and no detrimental matter to the environment. We used CHF3 reactive gas in reactive ion etching system. By controlling the etching parameter, inorganic alignment film can be removed on both the wafer and ITO glass. Inorganic deposition can be executed after removing of SiOx alignment film.