Modification of Ag-plated contacts by nitrogen ion implantation

被引:5
作者
Sun, M
Rong, MZ
Wang, QP
Chen, DG
机构
来源
ELECTRICAL CONTACTS - 1996: PROCEEDINGS OF THE FORTY-SECOND IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS: JOINT WITH THE 18TH INTERNATIONAL CONFERENCE ON ELECTRICAL CONTACTS | 1996年
关键词
ion implantation; Ag-plated contacts; modification;
D O I
10.1109/HOLM.1996.557228
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper focuses on the effects of nitrogen ion implantation on performance of Ag-plated contacts in a connector. The implant energy is 32-40 keV and implanted doses are between 1 similar to 4 x 10(17) ions/cm(2). The wear abrasion and friction tests were made on implanted and unimplanted contacts with an insertion-withdrawl testing apparatus. Moreover, in order to know the anticorrosion ability of the contacts, the diluted sulfuric acid corrosion taste were also made for those specimens. Surface hardness as well as contact resistance were measured during experiments. With the implanted contacts, the performance was found more stable and better than those unimplanted. By means of SEM micrographs, the paper attempts to explain the mechanisms of the wear resistance, stability of contact resistance, and anticorrosion in implanted contacts. It has been shown that it is a very promising way to improve properties of Ag-plated contacts by ion implantation.
引用
收藏
页码:467 / 471
页数:5
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