Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

被引：44
作者：
Kim, Sangkil [1 ]
Shamim, Atif [2 ]
Georgiadis, Apostolos [3 ]
Aubert, Herve [4 ]
Tentzeris, Manos M. [5 ]
机构：
[1] Qualcomm, San Diego, CA 92121 USA
[2] King Abdullah Univ Sci & Technol, Thuwal 239556900, Saudi Arabia
[3] Ctr Tecnol Telecomun Catalunya, Barcelona 08860, Spain
[4] Wireless Commun Res Grp, Natl Ctr Sci Res Micro & Nanosyst, Anal & Architecture Syst, F-31400 Toulouse, France
[5] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2016年 / 6卷 / 03期
基金：
欧盟地平线“2020”;
关键词：
Additive fabrication; inkjet-printed substrate-integrated waveguide (SIW); inkjet-printed via; low-cost via fabrication; polymethyl methacrylate (PMMA); CIRCUITS; ANTENNAS; SENSOR; TRACKS;
D O I：
10.1109/TCPMT.2016.2522461
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of similar to 0.2 Omega. An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.
引用
收藏
页码：486 / 496
页数：11
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