Case Study on Wire Bonding - Related Partial Discharge on High-Voltage Isolators

被引：0

作者：

Duangsang, Manita ^{[1
]}

Thankham, Nophakarn ^{[1
]}

机构：

[1] NXP Mfg Thailand Co Ltd, Prod Qual Ctr Bangkok, 303 Moo 3 Chaengwattana Rd, Bangkok 10210, Thailand

来源：

2018 25TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2018年

关键词：

High Voltage Isolation Testing; Treeing; Dielectric breakdown; Partial discharge;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Most devices which failed during High Voltage Isolation Testing seen a lateral dielectric breakdown after decapsulation. Failure analysis results explained the irregularity in IC assembly process causing the partial discharge that leads to dielectric breakdown, called treeing. This explanation together with root cause verification and wire bond parameter simulation from assembly process pointed out that the improper parameter modification resulted to electrical treeing.

引用

页数：3