Prediction of the decay resistance of heat treated wood on the basis of its elemental composition

被引：44
作者：
Sustersic, Ziga [2 ]
Mohareb, Ahmed [1 ,3 ]
Chaouch, Mounir [1 ]
Petrissans, Mathieu [1 ]
Petric, Marko [2 ]
Gerardin, Philippe [1 ]
机构：
[1] Nancy Univ, Lab Etud & Rech Mat Bois, EA 4370, Fac Sci & Tech, F-54506 Vandoeuvre Les Nancy, France
[2] Univ Ljubljana, Biotech Fac, Dept Wood Sci & Technol, Ljubljana 1000, Slovenia
[3] Univ Alexandria, Fac Agr, Dept Forestry & Wood Technol, Alexandria, Egypt
来源：
POLYMER DEGRADATION AND STABILITY | 2010年 / 95卷 / 01期
关键词：
Decay; Durability; Elemental composition; Carbon content; Heat treatment; Marker; THERMALLY MODIFIED WOOD; CHEMICAL-ANALYSIS; NORWAY SPRUCE; BEECH WOOD; IMPROVEMENT; DURABILITY; REASONS; NMR;
D O I：
10.1016/j.polymdegradstab.2009.10.013
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
The effect of heat treatment temperature on the elemental composition of Scots pine sapwood (Pinus sylvestris) has been investigated in the range of temperatures between 220 and 250 degrees C. The results revealed an important increase of carbon content, while oxygen content significantly decreases. Independently of the heat treatment temperature, elemental composition is strongly correlated with the mass losses due to thermal degradations. Carbon content as well as O/C ratio seem to represent valuable markers to estimate wood degradation after heat treatment. Heat treated specimens were exposed to fungal decay using the brown rot fungus Poria placenta and the weight losses due to fungal degradation were determined. Correlations between weight losses recorded after fungal exposure and elemental composition indicated that carbon content or O/C ratio can be used to predict wood durability conferred by heat treatment allowing us to envisage the development of a proper method to evaluate the quality of heat treated wood and predict its durability. These results also confirm that chemical modifications of wood cell wall polymers are the main factors responsible for wood durability improvement against fungal decay after heat treatment. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码：94 / 97
页数：4
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