Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging

被引：26

作者：

Krivec, Matic ^{[1
]}

Roshanghias, Ali ^{[1
]}

Abram, Arze ^{[2
]}

Binder, Alfred ^{[1
]}

机构：

[1] CTR Carinthian Tech Res AG, Europastr 12, A-9524 Villach, Austria

[2] Jozef Stefan Inst, Jamova Cesta 39, SI-1000 Ljubljana, Slovenia

来源：

MICROELECTRONIC ENGINEERING | 2017年 / 176卷

关键词：

Additive manufacturing; Inkjet printing; Rapid advanced packaging; SAW package;

D O I：

10.1016/j.mee.2016.12.021

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A rapid advanced packaging concept, consisting of 3D photopolymer printing and Ag nanoparticle printing, was investigated for the construction of a simple radio frequency identification (RFID) package with integrated surface acoustic wave transponder (SAW). An acrylate-type SAW package housing was printed with a multi-jet 3D printer and the corresponding antenna for the wireless read-out was manufactured via inkjet printing of Ag nanoparticle ink. The corresponding Ag structure had a thickness of about 2 pm with a sheet resistance of 250 m Omega sq(-1) after the photonic sintering processing. The chip-on-board and flip-chip packaging concepts were pursued for connecting the antenna structure to the chip pads. The SAW package prototype in a flip-chip configuration showed a significant signal to noise ratio (SNR) of about 30 dB via antenna-bridged radio frequency link at a moderate distance of 3 cm. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：1 / 5

页数：5

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