Direct comparison of two-dimensional dopant profiles by scanning capacitance microscopy with TSUPREM4 process simulation

被引:32
|
作者
McMurray, JS [1 ]
Kim, J
Williams, CC
Slinkman, J
机构
[1] Univ Utah, Dept Phys, Salt Lake City, UT 84112 USA
[2] IBM Corp, Microelect, Essex Junction, VT 05452 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1998年 / 16卷 / 01期
关键词
D O I
10.1116/1.589808
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Quantitative two-dimensional (2D) dopant profiling of a gatelike structure is achieved by scanning capacitance microscopy (SCM) on a cross-sectioned polished silicon wafer. The gatelike structures consist of heavily implanted n+ regions separated by a Lighter doped ta region underneath a 0.56 mu m grate. The SCM is operated in the constant change capacitance mode while scanning with a 37 nm radius tip. The 2D SCM data are converted to dopant density through a physical model of the SCM/silicon interaction. The model parameters are adjusted so that the SCM dopant profile far from the gate edge fits the vertical secondary ion mass spectrometry (SIMS) profile. A 15% error in average accuracy is found between SCM and SIMS profiles evaluated over the dopant range of 10(20)-10(17) cm(-3). The same model parameters are used for all points in converting the 2D SCM data, indicating that the accuracy of the full 2D result should be comparable to that of the vertical profile. A direct comparison of the 2D SCM and 2D TSUPREM4 results is made for the first time. The agreement is generally good, but there are some notable differences. (C) 1998 American Vacuum Society.
引用
收藏
页码:344 / 348
页数:5
相关论文
共 50 条
  • [1] Direct comparison of two-dimensional dopant profiles by scanning capacitance microscopy with TSUPREM4 process simulation
    McMurray, J.S.
    Kim, J.
    Williams, C.C.
    Slinkman, J.
    Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 1998, 16 (01): : 344 - 348
  • [2] Two dimensional dopant diffusion study by scanning capacitance microscopy and TSUPREM IV process simulation
    Kim, J
    McMurray, JS
    Williams, CC
    Slinkman, J
    CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY, 1998, 449 : 720 - 724
  • [3] Scanning capacitance microscopy measurement of two-dimensional dopant profiles across junctions
    Kopanski, J.J.
    Marchiando, J.F.
    Berning, D.W.
    Alvis, R.
    Smith, H.E.
    Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, 1998, 16 (01):
  • [4] Scanning capacitance microscopy measurement of two-dimensional dopant profiles across junctions
    Kopanski, JJ
    Marchiando, JF
    Berning, DW
    Alvis, R
    Smith, HE
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (01): : 339 - 343
  • [5] Two-dimensional dopant profiling by scanning capacitance microscopy
    Williams, CC
    ANNUAL REVIEW OF MATERIALS SCIENCE, 1999, 29 : 471 - 504
  • [6] Two-dimensional dopant profiling by scanning capacitance force microscopy
    Kimura, K
    Kobayashi, K
    Yamada, H
    Matsushige, K
    APPLIED SURFACE SCIENCE, 2003, 210 (1-2) : 93 - 98
  • [7] Quantitative two-dimensional dopant profiling of abrupt dopant profiles by cross-sectional scanning capacitance microscopy
    Huang, Y
    Williams, CC
    Wendman, MA
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1996, 14 (03): : 1168 - 1171
  • [8] Two-dimensional simulation of scanning capacitance microscopy measurements of arbitrary doping profiles
    Ciampolini, L
    Ciappa, M
    Malberti, P
    Fichtner, W
    2000 INTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, TECHNICAL PROCEEDINGS, 2000, : 48 - 51
  • [9] Two-dimensional dopant diffusion study using scanning capacitance microscopy
    Yu, GYM
    Griffin, PB
    Plummer, JD
    SI FRONT-END PROCESSING-PHYSICS AND TECHNOLOGY OF DOPANT-DEFECT INTERACTIONS, 1999, 568 : 233 - 237
  • [10] Scanning capacitance microscopy applied to two-dimensional dopant profiling of semiconductors
    Kopanski, JJ
    Marchiando, JF
    Lowney, JR
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1997, 44 (1-3): : 46 - 51