Preparation and Characterization of a Thermal Insulating Carbon Xerogel-Epoxy Composite Adhesive for Electronics Applications

被引：8
作者：
Fagnard, Jean-Francois [1 ]
Stoukatch, Serguei [1 ]
Laurent, Philippe [1 ]
Dupont, Francois [1 ]
Wolfs, Cedric [2 ]
Lambert, Stephanie D. [2 ]
Redoute, Jean-Michel [1 ]
机构：
[1] Univ Liege, Dept Elect Engn & Comp Sci, Microsys Lab, B-4102 Liege, Belgium
[2] Univ Liege, Dept Chem Engn Nanomat Catalysis & Electrochem, B-4000 Liege, Belgium
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2021年 / 11卷 / 04期
关键词：
Thermal conductivity; Conductivity; Electronic packaging thermal management; Carbon; Thermal management; Temperature measurement; Heat sinks; Composite materials; microassembly; microsensors; microsystems (MSs); thermal conductivity measurements; CONDUCTIVITY;
D O I：
10.1109/TCPMT.2021.3059478
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In some specific microelectronic applications, there is a demand for adhesive materials (glues/encapsulants) having very good thermal insulation properties. We have studied the properties obtained on epoxy-based samples loaded by several levels of xerogel filling. The thermal conductivity of these materials depends on the exact chemical composition and their manufacturing process. As a result, the thermal conductivity given in the manufacturer's specifications or in the literature generally exhibits some dispersion. Therefore, we have developed a straightforward experimental rig, based on a vacuum chamber and miniature Pt100 sensors measurements, to precisely know the thermal conductivity of the various insulating materials used in the development and the assembly of select microsensors and microsystems. The results showed a decrease in the thermal conductivity of our xerogel-epoxy composites up to 35.8% compared with the value of the unfilled epoxy, corresponding to a thermal conductivity value of 107.9 mW m(-1) K-1. In addition, cross-sectional images were observed by optical microscopy to characterize the specific microstructure of each sample to relate these observations to improvements in thermal conductivity.
引用
收藏
页码：606 / 615
页数：10
相关论文
共 46 条
  • [1] Energy-Efficient Phase-Change Memory with Graphene as a Thermal Barrier
    Ahn, Chi-Yui
    Fong, Scott W.
    Kim, Yongsung
    Lee, Seunghyun
    Sood, Aditya
    Neumann, Christopher M.
    Ashegh, Mehdi
    Goodson, Kenneth E.
    Pop, Eric
    Wong, H. -S. Philip
    [J]. NANO LETTERS, 2015, 15 (10) : 6809 - 6814
  • [2] [Anonymous], 2008, 1002008 JCGM BIPM, V100, P2008
  • [3] Ardebili H, 2009, MATER PR ELECT APPL, P1
  • [4] Monte Carlo simulation of the effective thermal conductivity in two-phase material
    Belova, IV
    Murch, GE
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2004, 153 (1-3) : 741 - 745
  • [5] High-performance bulk thermoelectrics with all-scale hierarchical architectures
    Biswas, Kanishka
    He, Jiaqing
    Blum, Ivan D.
    Wu, Chun-I
    Hogan, Timothy P.
    Seidman, David N.
    Dravid, Vinayak P.
    Kanatzidis, Mercouri G.
    [J]. NATURE, 2012, 489 (7416) : 414 - 418
  • [6] Electrical and Thermal Conductivity of Epoxy-Carbon Filler Composites Processed by Calendaring
    Caradonna, Andrea
    Badini, Claudio
    Padovano, Elisa
    Pietroluongo, Mario
    [J]. MATERIALS, 2019, 12 (09)
  • [7] Materials for thermal conduction
    Chung, DDL
    [J]. APPLIED THERMAL ENGINEERING, 2001, 21 (16) : 1593 - 1605
  • [8] Thermal barrier coating materials
    Clarke, David R.
    Phillpot, Simon R.
    [J]. MATERIALS TODAY, 2005, 8 (06) : 22 - 29
  • [9] Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities
    Cui, Ying
    Li, Man
    Hu, Yongjie
    [J]. JOURNAL OF MATERIALS CHEMISTRY C, 2020, 8 (31) : 10568 - 10586
  • [10] Czichos H., 2006, HDB MAT MEAS METHOD, P1208, DOI [10.1007/978-3-540-30300-8, DOI 10.1007/978-3-540-30300-8]
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