Interfacial microstructure and mechanical strength of WC-Co/90MnCrV8 cold work tool steel diffusion bonded joint with Cu/Ni electroplated interlayer

被引:61
作者
Barrena, M. I. [1 ]
Gomez de Salazar, J. M. [1 ]
Matesanz, L. [1 ]
机构
[1] Univ Complutense Madrid, Fac Chem, Dept Mat Sci, E-28040 Madrid, Spain
来源
MATERIALS & DESIGN | 2010年 / 31卷 / 07期
关键词
Diffusion bonding; Cemented carbide; Steel; Welding; Microstructure; Mechanical properties; STAINLESS-STEEL; ALLOY; IRON;
D O I
10.1016/j.matdes.2010.01.050
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An important challenge in the design and processing of engineering materials is to combine incompatible properties of materials in the same component. One of the most common processes for joining dissimilar materials is brazing, but as a result of the poor resistance of the joints in service at high temperatures, diffusion bonding is proposed as the best suited alternative bonding process. In the present investigation, a cemented carbide (WC-15%Co) and a cold work tool steel (90MnCrV8) have been diffusion bonded in vacuum, using a ductile interlayer. Effects of the bonding time (30-60 min) and temperature (825-850 degrees C) on the quality of diffusion bonding interfaces were studied. The maximum tensile strength obtained confirms a very promising technology for industrial applications. (c) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:3389 / 3394
页数:6
相关论文
共 21 条
  • [1] [Anonymous], 1993, ASM HDB, V6
  • [2] Weldability of Al4C3-Al composites via diffusion welding technique
    Arik, H
    Aydin, M
    Kurt, A
    Turker, M
    [J]. MATERIALS & DESIGN, 2005, 26 (06) : 555 - 560
  • [3] *ASM INT, 1998, CERM ASM HDB, V2
  • [4] *ASM INT, 2001, TOOL STEELS MET HDB, V1
  • [5] *ASM INT, 1998, CEM CARB ASM HDB, V2
  • [6] Transient liquid phase diffusion bonding under a temperature gradient: Modelling of the interface morphology
    Assadi, H
    Shirzadi, AA
    Wallach, ER
    [J]. ACTA MATERIALIA, 2001, 49 (01) : 31 - 39
  • [7] Characterization of WC-Co/Ti6Al4V diffusion bonding joints using Ag as interlayer
    Barrena, M. I.
    Gomez de Salazar, J. M.
    Merino, N.
    Matesanz, L.
    [J]. MATERIALS CHARACTERIZATION, 2008, 59 (10) : 1407 - 1411
  • [8] Al2O3/Ti6Al4V diffusion bonding joints using Ag-Cu interlayer
    Barrena, M. I.
    Matesanz, L.
    Gomez de Salazar, J. M.
    [J]. MATERIALS CHARACTERIZATION, 2009, 60 (11) : 1263 - 1267
  • [9] Molecular dynamics modeling of diffusion bonding
    Chen, SD
    Soh, AK
    Ke, FJ
    [J]. SCRIPTA MATERIALIA, 2005, 52 (11) : 1135 - 1140
  • [10] Interfacial microstructure and mechanical strength of ferritic stainless steel and silicated graphite joints bonded with Cu/Ni composite interlayers
    Chun, CJ
    Yong, HC
    Song, ZJ
    [J]. SCRIPTA MATERIALIA, 2006, 54 (04) : 553 - 557