Proposed configuration of integrated optical isolator employing wafer-direct bonding technique

被引：40
|
作者：
Yokoi, H [1 ]
Mizumoto, T [1 ]
机构：
[1] Tokyo Inst Technol, Fac Engn, Dept Phys Elect, Meguro Ku, Tokyo 152, Japan
来源：
ELECTRONICS LETTERS | 1997年 / 33卷 / 21期
关键词：
optical isolators; wafer bonding;
D O I：
10.1049/el:19971253
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of a wafer-direct bonding technique. Magnetic garnets with a large magnetooptic effect miniaturise the size of the nonreciprocal phase shifter to several hundreds of microns.
引用
收藏
页码：1787 / 1788
页数：2
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