共 50 条
[35]
Simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time - temperature - moisture concentration superposition
[J].
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021),
2021,
:989-994
[37]
Investigation of Moisture-Induced Warpage of Chip-on-Wafer in 2.5D IC Package
[J].
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022),
2022,
:1095-1102