共 50 条
[26]
AN INVESTIGATION OF MOISTURE-INDUCED INTERFACIAL DELAMINATION IN PLASTIC IC PACKAGE DURING SOLDER REFLOW
[J].
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017,
2017,
[28]
Moisture-induced roughening during "water coating" of precalendered wood-containing paper
[J].
JOURNAL OF PULP AND PAPER SCIENCE,
1998, 24 (10)
:301-307