The performance of the vapor chamber based on the plant leaf

被引:65
作者
Liu, Wangyu [1 ]
Peng, Yi [1 ,2 ]
Luo, Tao [1 ]
Luo, Yuanqiang [1 ]
Huang, Kaidong [1 ]
机构
[1] S China Univ Technol, Sch Mech & Automot Engn, 381 Wushan Rd, Guangzhou 510641, Guangdong, Peoples R China
[2] Guizhou Univ, Sch Mech Engn, Guiyang 550025, Peoples R China
基金
中国国家自然科学基金;
关键词
Vapor chamber; Thermal resistance; Temperature uniformity; Chemical etching; HEAT-PIPE; THERMAL-CHARACTERISTICS; WICK STRUCTURE; MICROCHANNELS; OPTIMIZATION; MICROGROOVES; EVAPORATION; RESISTANCE; PRINCIPLE; DESIGN;
D O I
10.1016/j.ijheatmasstransfer.2016.02.091
中图分类号
O414.1 [热力学];
学科分类号
摘要
The performance of a novel vapor chamber based on the leaf vein system is tested in this study. In this vapor chamber, the conceptual structure, being composed of leaf-vein-like fractal network and micro fin-pins and used to simulate the transportation principle of plant leaf, is made on the inner surface of the top copper plate to form the wick of the condenser. To the inner surface of the bottom, a copper plate sintered with a layer of porous wick is used as the evaporator. Because the conceptual structure is not restricted by the shape, the vapor chamber is made into circular and rectangular shape respectively. In the circular vapor chamber, the supporting columns sintered with copper powder are used to strength the vapor chamber. However, in the rectangular vapor chamber, the wick of the condenser contacts directly with the wick of the evaporator so as to strength the vapor chamber and shorten the back flow length of the liquid condensed on the groove surface. In the circular vapor chamber, the fractal angle of the leaf-vein-like fractal network is 30-70 degrees, and the vapor chamber is packaged with eight bolts for convenience. In the measurement, the vapor chamber has small thermal resistance when the fractal angle is 40 degrees and 50 degrees, and in the rectangular vapor chamber, the thermal resistance of the vapor chamber is about 0.06 C/W. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码:746 / 757
页数:12
相关论文
共 42 条
  • [1] [Anonymous], 2008, J HEAT TRANSFER
  • [2] Bejan A., 2000, Shape and Structure, from Engineering to Nature
  • [3] Experimental study of evaporative heat transfer in sintered copper bidispersed wick structures
    Cao, XL
    Cheng, P
    Zhao, TS
    [J]. JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 2002, 16 (04) : 547 - 552
  • [4] Chen Y.T., 2009, P 2009 4 INT MICR IE, P340
  • [5] Thermal response of a heat pipe with axially "Ω"-shaped microgrooves
    Chen, Yongping
    Yao, Feng
    Shi, Mingheng
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (15-16) : 4476 - 4484
  • [6] Thermal Characteristics of Heat Pipe with Axially Swallow-tailed Microgrooves
    Chen Yongping
    Zhu Wangfa
    Zhang Chengbin
    Shi Mingheng
    [J]. CHINESE JOURNAL OF CHEMICAL ENGINEERING, 2010, 18 (02) : 185 - 193
  • [7] Heat transfer and pressure drop in fractal tree-like microchannel nets
    Chen, YP
    Cheng, P
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2002, 45 (13) : 2643 - 2648
  • [8] Flow boiling performance of Ω-shaped reentrant copper microchannels with different channel sizes
    Deng, Daxiang
    Xie, Yanlin
    Huang, Qinsong
    Tang, Yong
    Huang, Lantao
    Huang, Xiang
    [J]. EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2015, 69 : 8 - 18
  • [9] Parametric Study on Flow Boiling Characteristics in Ω-Shaped Re-Entrant Porous Microchannels With Structured Surface
    Deng, Daxiang
    Tang, Yong
    Qin, Yu
    Wang, Xiaoyu
    Zhang, Jingrui
    Cai, Huikun
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (08): : 1108 - 1121
  • [10] A mathematical model for analyzing the thermal characteristics of a flat micro heat pipe with a grooved wick
    Do, Kyu Hyung
    Kim, Sung Jin
    Garimella, Suresh V.
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2008, 51 (19-20) : 4637 - 4650