Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes

被引：67

作者：

Chen, Dapeng ^{[1
]}

Qiao, Xueliang ^{[1
]}

Qiu, Xiaolin ^{[2
]}

Tan, Fatang ^{[1
]}

Chen, Jianguo ^{[1
]}

Jiang, Renzhi ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, State Key Lab Plast Forming Simulat & Die & Mould, Wuhan 430074, Peoples R China

[2] Nanchang Inst Technol, Nanomat Res Ctr, Nanchang 330013, Jiangxi, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2010年 / 21卷 / 05期

关键词：

MICROWAVE-ASSISTED SYNTHESIS; NANOPARTICLES; NANOWIRES; NANOCUBES;

D O I：

10.1007/s10854-009-9943-y

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silver flakes are the most widely applied conductive fillers in electrically conductive adhesives (ECAs) because of their high conductivity and stable chemical properties. It is expected that there are advanced ECAs with both high electrical conductance and good adhesive strength. The high filler loadings can improve the conductance of ECAs, whereas the adhesive strength is decreased. Silver nanostructures are incorporated for the purpose of electrical conductance and adhesive strength improvement of ECAs. A simple method has enabled the synthesis of silver nanostructures by reducing silver nitrate with ethylene glycol in the presence of poly(N-vinylpyrrolidone). They are added to ECAs by dispersing them in ethanol while it is used as the diluent to adjust the volatility of ECAs, preventing them from the aggregation. This proposed process offers the possibility to effectively use silver nanostructures for improving the conductivity of ECAs at the low content of conductive fillers while good adhesive strength may be obtained.

引用

页码：486 / 490

页数：5

共 31 条

[1] Seedless, surfactantless wet chemical synthesis of silver nanowires [J].