共 8 条
- [1] [Anonymous], 1945, J APPL MECH
- [2] Coffin L.F., 1954, T AM SOC MECH ENG, V76, P931, DOI [10.1115/1.4015020, DOI 10.1115/1.4015020]
- [3] Hallberg O., 1991, Quality and Reliability Engineering International, V7, P169, DOI 10.1002/qre.4680070308
- [4] Manson S. S., 1965, EXPT MECH, V5, P193
- [5] Nelson W., 1990, Accelerated testing: statistical models, test plans, and data analysis
- [6] Peck D. S., 1986, 24th Annual Proceedings Reliability Physics 1986 (Cat. No.86CH2256-6), P44, DOI 10.1109/IRPS.1986.362110
- [7] ASSESSING TIME-TO-FAILURE DUE TO CONDUCTIVE FILAMENT FORMATION IN MULTILAYER ORGANIC LAMINATES [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (03): : 269 - 276
- [8] SANDOR BI, 1972, FUNDAMENTALS CYCLIC