Advanced structural similarity rules for the BGA package family

被引:10
作者
van Driel, W. D.
Mavinkurve, A.
van Gils, M. A. J.
Zhang, G. Q.
机构
[1] NXP Semicond, NL-6534 AE Nijmegen, Netherlands
[2] Delft Univ Technol, NL-2600 GA Delft, Netherlands
关键词
Ball grid arrays (BGA) - Package designs - Structural similarity rules - Wafer fabrication processes;
D O I
10.1016/j.microrel.2006.09.005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To efficiently select qualification and reliability monitoring programs, structural similarity rules for Integrated Circuit designs, wafer fabrication processes and/or package designs are currently used by the industry. By following the package Structural similarity rules, the numbers of reliability qualification tests may be greatly reduced. However, when looking at the present rules it is clear that they are not reliably defined. For instance, geometrical parameters such its die-to-pad ratio are not quantitatively included and it seems that linear relationships are assumed. Besides that, these rules are mainly deducted from experience and industrial trial and error results, not from reliability physics. Driven by the present development trends of microelectronics (miniaturization, integration, cost reduction, etc) it is urgently needed to develop 'advanced based structural similarity rules' based on reliability physics (physics of failures), to meet the industrial development trends. In this Study, we have used DOE/RMS techniques to deduct advanced structural similarity rules through simulation-based optimisation techniques. Parametric 3D non-linear FE models are used to explore the responses of the complete ball grid array (BGA) package family for both the thermo-mechanical and moisture-diffusion responses as function of six parameters among which the die-to-pad ratio and the body size. In this way, advanced Structural similarity rules are deduced which can be used to shorten design cycles. Even more, by using the accurate 3D non-linear reliability prediction models easy tools can he created for package designers. By using such a tool, the number of reliability qualification tests can be reduced. More importantly, possible failure mechanisms can be (better) understood and predicted. (c) 2006 Elsevier Ltd. All rights reserved.
引用
收藏
页码:205 / 214
页数:10
相关论文
共 20 条
  • [1] A test specimen for determining the fracture resistarim of bimaterial interfaces
    Charalambides, PG
    Lund, J
    Evans, AG
    McMeeking, RM
    [J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 1989, 56 (01): : 77 - 82
  • [2] DUDEK R, 2002, P EUR, P225
  • [3] GILLEO K, 2001, SEMICOND INT, V1
  • [4] Modified four-point bending specimen for determining the interface fracture energy for thin, brittle layers
    Hofinger, I
    Oechsner, M
    Bahr, HA
    Swain, MV
    [J]. INTERNATIONAL JOURNAL OF FRACTURE, 1998, 92 (03) : 213 - 220
  • [5] *NOES INC, 2005, OPTIMUS VERS 5 0 OPT
  • [6] MULTIPARAMETER STRUCTURAL OPTIMIZATION USING FEM AND MULTIPOINT EXPLICIT APPROXIMATIONS
    TOROPOV, VV
    FILATOV, AA
    POLYNKIN, AA
    [J]. STRUCTURAL OPTIMIZATION, 1993, 6 (01): : 7 - 14
  • [7] Prediction of delamination related IC & packaging reliability problems
    van Driel, WD
    van Gils, MAJ
    van Silfhout, RBR
    Zhang, GQ
    [J]. MICROELECTRONICS RELIABILITY, 2005, 45 (9-11) : 1633 - 1638
  • [8] Influence of material combinations on delamination failures in a cavity-down TBGA package
    van Driel, WD
    Wisse, G
    Chang, AYL
    Janssen, JHJ
    Fan, XJ
    Zhang, KGQ
    Ernst, LJ
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (04): : 651 - 658
  • [9] van Driel WD, 2004, THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, P211
  • [10] van Driel WD, 2004, THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, P53