MEMS post-packaging by localized heating and bonding

被引：127
作者：
Lin, LW [1 ]
机构：
[1] Univ Calif Berkeley, Dept Mech Engn, Berkeley, CA 94720 USA
来源：
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2000年 / 23卷 / 04期
基金：
美国国家科学基金会;
关键词：
CVD bonding; eutectic bonding; fusion bonding; MEMS; packaging; solder bond;
D O I：
10.1109/6040.883749
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging filed of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field but also speeds up the product commercialization cycle. A review of engineering bases describing current technologies of MEMS packaging and wafer bonding is followed by an innovative post-packaging approach by localized heating and bonding. Process demonstrations by selective encapsulation are presented, including an integrated low pressure chemical vapor deposition (LPCVD) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.
引用
收藏
页码：608 / 616
页数：9
相关论文
共 62 条
  • [1] A modular micromachined high-density connector for implantable biomedical systems
    Akin, T
    Ziaie, B
    Najafi, K
    [J]. NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS, 1996, : 497 - 502
  • [2] [Anonymous], J APPL PHYS B
  • [3] [Anonymous], SOLDERING ELECT
  • [4] ANODIC BONDING OF IMPERFECT SURFACES
    ANTHONY, TR
    [J]. JOURNAL OF APPLIED PHYSICS, 1983, 54 (05) : 2419 - 2428
  • [5] Audet S. A., 1997, P 1997 INT C SOL STA, P287
  • [6] THE PACKAGING OF IMPLANTABLE INTEGRATED SENSORS
    BOWMAN, L
    MEINDL, JD
    [J]. IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, 1986, 33 (02) : 248 - 255
  • [7] BUTLER J, 1997, P TRANSD 97, P261
  • [8] Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging
    Cheng, YT
    Lin, LW
    Najafi, K
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2000, 9 (01) : 3 - 8
  • [9] Cheng YT, 1999, PROC IEEE MICR ELECT, P285, DOI [10.1109/MEMSYS.1999.746837, 10.1109/SSDM.1999.787652]
  • [10] COHN MB, 1996, P IEEE SOL STAT SENS, P32
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