Viscoelastic analysis of adhesively bonded double-lap joint

被引:0
|
作者
Lee, Sang Soon [1 ]
机构
[1] Korea Univ Technol & Educ, Sch Mechatron Engn, Cheonan 330600, Chungnam, South Korea
来源
Mechanical Behavior of Materials X, Pts 1and 2 | 2007年 / 345-346卷
关键词
viscoelastic adhesive; double-lap joint; epoxy; interface stress; boundary element method;
D O I
10.4028/www.scientific.net/KEM.345-346.1473
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, stress distribution in a double lap joint subjected to a tensile load is investigated using the boundary element method. The adhesive used in this study is a commercial epoxy system which can be cured at room temperature, The adhesive is assumed to be linearly viscoelastic. The order of the singularity is obtained numerically for a given viscoelastic model. The numerical results show that interface stresses are large enough to initiate local yielding or edge cracks. Since the exceedingly large stresses cannot be borne by the adhesive layer, edge cracks can occur at the interface corner.
引用
收藏
页码:1473 / 1476
页数:4
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