Plasma-surface interaction in negative hydrogen ion sources

被引:11
作者
Wada, Motoi [1 ]
机构
[1] Doshisha Univ, Grad Sch Sci & Engn, Kyotanabe, Kyoto 6100321, Japan
基金
日本学术振兴会;
关键词
SPUTTERING YIELDS; H-IONS; ENERGY; CESIUM; IONIZATION; TUNGSTEN; ATOMS; CS;
D O I
10.1063/1.5016262
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
A negative hydrogen ion source delivers more beam current when Cs is introduced to the discharge, but a continuous operation of the source reduces the beam current until more Cs is added to the source. This behavior can be explained by adsorption and ion induced desorption of Cs atoms on the plasma grid surface of the ion source. The interaction between the ion source plasma and the plasma grid surface of a negative hydrogen ion source is discussed in correlation to the Cs consumption of the ion source. The results show that operation with deuterium instead of hydrogen should require more Cs consumption and the presence of medium mass impurities as well as ions of the source wall materials in the arc discharge enlarges the Cs removal rate during an ion source discharge. Published by AIP Publishing.
引用
收藏
页数:7
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