Large format CID x-ray image sensor

被引:6
作者
Carbone, J [1 ]
Alam, Z [1 ]
Borman, C [1 ]
Czebiniak, S [1 ]
Ziegler, H [1 ]
机构
[1] CIDTEC, Liverpool, NY 13088 USA
来源
SOLID STATE SENSOR ARRAYS: DEVELOPMENT AND APPLICATIONS II | 1998年 / 3301卷
关键词
CIDs; dental X-ray; electronic imaging; radiation-hardened; charge transfer device;
D O I
10.1117/12.304550
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A large format (31 x 23 mm(2) display) CID imager module capitalizes on CID large well capacity and radiation resistance to image dental x-rays. The module, which consists of the imager, conversion phosphor and ancillary electronics, is encapsulated in a 40 x 28 x 5 mm(3) robust package that is lightproof, moisture-proof and meets FDA and RFL/EMI standards. Data exposure and readout is simple. The imager normally exists in an active reset mode until X-ray application automatically places the imager into a charge integration mode. Readout begins immediately upon completion of the x-ray exposure or manual application of an external trigger source. The imager returns to the reset mode once the data read out is complete. Pixels are arranged in an SVGA compatible 800(H) x 600(V) format. Each pixel is square and 38.5 microns/side. The imager is coated using a proprietary phosphor deposition process that results in a limiting resolution of 9 LP/mm from an X-ray illumination source. Better than 2,000:1 dynamic range and shot-noise limited operation is achieved. Direct X-ray detection and attendant noise is minimized via the phosphor and epitaxial layer that lies beneath the pixel array. The imager/module architecture and electro-optical performance are described in detail here in.
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页码:90 / 99
页数:10
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