Internal Stress Control of Nickel-Phosphorus Electrodeposits Using Pulse Currents

被引:26
作者
Chen, F. J. [1 ,2 ]
Pan, Y. N. [1 ]
Lee, C. Y. [3 ]
Lin, C. S. [2 ]
机构
[1] Natl Taiwan Univ, Dept Mech Engn, Taipei 106, Taiwan
[2] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 106, Taiwan
[3] Natl Taipei Univ Technol, Dept Mech Engn, Taipei 106, Taiwan
关键词
adhesion; compressibility; electrodeposits; electroplating; grain size; internal stresses; nickel; pH; phosphorus; reduction (chemical); NI-P ALLOYS; AMORPHOUS-ALLOYS; THIN-FILMS; MECHANISM; EVOLUTION; HYDROGEN; BATHS;
D O I
10.1149/1.3285108
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Nickel-phosphorus deposits with various phosphorus contents and internal stresses were electroplated from a nickel sulfamate bath without an additive by varying the duty cycle and frequency of the pulse current. A reduction in the duty cycle increased the phosphorus content and decreased the internal tensile stresses in the deposit. At a 0.1 duty cycle, a deposit with slightly compressive internal stress was produced. A deposit with a thickness of several hundred micrometers was plated at 0.1 duty cycle on a copper plate with good adhesion. Because the waveform parameters of the pulse current strongly affects the current efficiency and the microstructure of the deposit, the internal stress of the deposit as a function of the current efficiency, phosphorus content, and grain size was measured and discussed.
引用
收藏
页码:D154 / D158
页数:5
相关论文
共 22 条
[1]  
BONINO JP, 1992, PLAT SURF FINISH, V79, P62
[2]   Physical incorporation of saccharin molecules into electrodeposited soft high magnetic moment CoFe alloys [J].
Brankovic, Stanko R. ;
Haislmaier, Ryan ;
Vasiljevic, Natasa .
ELECTROCHEMICAL AND SOLID STATE LETTERS, 2007, 10 (06) :D67-D71
[3]   Electrodeposition of Ni-P alloys from a sulfamate electrolyte relationship between bath pH and structural characteristics [J].
Chang, L. ;
Chen, C. -H. ;
Fang, H. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (01) :D57-D61
[4]   Electrochemical nickel-phosphorus alloy formation [J].
Daly, BP ;
Barry, FJ .
INTERNATIONAL MATERIALS REVIEWS, 2003, 48 (05) :326-338
[5]   THE MECHANISM OF PHOSPHORUS INCORPORATION DURING THE ELECTRODEPOSITION OF NICKEL-PHOSPHORUS ALLOYS [J].
HARRIS, TM ;
DANG, QD .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (01) :81-83
[6]   STRESSES IN THIN-FILMS - RELEVANCE OF GRAIN-BOUNDARIES AND IMPURITIES [J].
HOFFMAN, RW .
THIN SOLID FILMS, 1976, 34 (02) :185-190
[7]  
LASHMORE DS, 1982, PLAT SURF FINISH, V69, P72
[8]   Electrodeposition of nickel-phosphorus alloy from sulfamate baths with improved current efficiency [J].
Lin, CS ;
Lee, CY ;
Chen, FJ ;
Chien, CT ;
Lin, PL ;
Chung, WC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (06) :C387-C392
[9]   Structural evolution and internal stress of nickel-phosphorus electrodeposits [J].
Lin, CS ;
Lee, CY ;
Chen, FJ ;
Li, WC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (06) :C370-C375
[10]  
Mallory G., 1990, Electroless Plating: Fundamentals And Applications