Corrosion Electrochemical Kinetic Study of Copper in Acidic Solution using Scanning Electrochemical Microscopy

被引:25
作者
Zhang, Qinhao [1 ]
Zhu, Zejie [1 ]
Liu, Pan [1 ]
Zhang, Jianqing [1 ]
Cao, Fahe [1 ,2 ]
机构
[1] Zhejiang Univ, Dept Chem, Hangzhou 310027, Zhejiang, Peoples R China
[2] Sun Yat Sen Univ, Sch Mat, Guangzhou 510006, Guangdong, Peoples R China
基金
国家重点研发计划; 中国国家自然科学基金;
关键词
GENERATION/SUBSTRATE COLLECTION MODE; RADIATION-INDUCED CORROSION; ANODIC-DISSOLUTION; NACL SOLUTION; CHLORIDE COMPLEXES; ATOMIC-FORCE; CUPROUS ION; OXIDE LAYER; MECHANISM; ELECTRODISSOLUTION;
D O I
10.1149/2.0061913jes
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The cathodic hydrogen evolution and anodic dissolution behavior of pure copper in acidic solution were investigated by tip generation/substrate collection mode of scanning electrochemical microscopy. The cupric ion generated by copper anodic dissolution without complexation with Cl was directly monitored and quantitatively analyzed in the potential range between 0.266 V and 0.516 V vs NHE. Based on COMSOL simulation and Tafel linear fitting, the standard rate constants and transfer coefficients of hydrogen evolution reaction, copper oxidation to cupric ion and copper ion are 1.28 x 10(-4) cm/s and 0.29, 5.69 x 10(-4) cm/s and 0.42, 1.31 x 10(-4) cm/s and 0.76, respectively. Moreover, both the proton reduction and oxygen reduction reactions strongly depend on the electrode potential, which should be carefully considered and distinguished for polarization curve analysis of Cu in an acidic solution. (C) The Author(s) 2019. Published by ECS.
引用
收藏
页码:C401 / C409
页数:9
相关论文
共 60 条
[1]   LIMITATION TO MIXED POTENTIAL CONCEPT OF METAL CORROSION - COPPER IN OXYGENATED SULFURIC-ACID SOLUTIONS [J].
ANDERSEN, TN ;
GHANDEHARI, MH ;
EYRING, H .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (12) :1580-1585
[2]  
Bard A. J., 2012, SCANNING ELECTROCHEM
[3]  
Bard A. J., 1980, ELECTROCHEMICAL METH
[4]   Radiation Induced Corrosion of Copper in Humid Air and Argon Atmospheres [J].
Bjorkbacka, Asa ;
Johnson, C. Magnus ;
Leygraf, Christofer ;
Jonsson, Mats .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2017, 164 (04) :C201-C206
[5]   Role of the Oxide Layer in Radiation-Induced Corrosion of Copper in Anoxic Water [J].
Bjorkbacka, Asa ;
Johnson, C. Magnus ;
Leygraf, Christofer ;
Jonsson, Mats .
JOURNAL OF PHYSICAL CHEMISTRY C, 2016, 120 (21) :11450-11455
[6]   MECHANISM OF ELECTRODEPOSITION AND DISSOLUTION PROCESSES OF COPPER IN AQUEOUS SOLUTIONS [J].
BOCKRIS, JO ;
ENYO, M .
TRANSACTIONS OF THE FARADAY SOCIETY, 1962, 58 (474) :1187-&
[7]   ELECTRODISSOLUTION KINETICS OF COPPER IN ACIDIC CHLORIDE SOLUTIONS [J].
BRAUN, M ;
NOBE, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (10) :1666-1671
[8]   Electrochemical Impedance Spectroscopy [J].
Chang, Byoung-Yong ;
Park, Su-Moon .
ANNUAL REVIEW OF ANALYTICAL CHEMISTRY, VOL 3, 2010, 3 :207-229
[9]   Study of corrosion behavior of copper in 3.5 wt.% NaCl solution containing extracellular polymeric substances of an aerotolerant sulphate-reducing bacteria [J].
Chen, Shiqiang ;
Zhang, Dun .
CORROSION SCIENCE, 2018, 136 :275-284
[10]   Nanometer-Scale Corrosion of Copper in De-Aerated Deionized Water [J].
Cleveland, Christopher ;
Moghaddam, Saeed ;
Orazem, Mark E. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2014, 161 (03) :C107-C114