Wireless Power Distribution Network for 3D Package Using Magnetic Field Resonance

被引:0
作者
Song, Eunseok [1 ]
Kim, Hongseok [1 ]
Song, Chiuk [1 ]
Kim, Jonghoon J. [1 ]
Kim, Joungho [1 ]
机构
[1] Korea Adv Inst Sci & Technol, Dept Elect Engn, Terahertz Interconnect & Package Lab, Taejon, South Korea
来源
2013 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) | 2013年
关键词
wireless power transfer (WPT); power distribution network (PDN); 3D package; magnetic field; resonance; inductor design; PDN-impedance; power efficiency; simultaneous switching noise (SSN);
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a wireless power transfer (WPT) scheme using magnetic field resonances for 3D packages is proposed and a wireless power distribution network (PDN) in a WPT system is analyzed in terms of the simultaneous switching noise (SSN). For analyzing the wireless PDN impedance characteristic and the power efficiency, a ball grid array (BGA) package with a size of 35 mmx35 mm is fabricated. Also, a new schematic of the wire PDN is defined to analyze a WPT system applied to the WPT system in terms of SSN. The impedance (Z(11)) characteristics between the interconnection-based hierarchical PDN structure and the hierarchical PDN based on the proposed WPT scheme are compared and analyzed. The package-level WPT system proposed in this study represents excellent wireless PDN impedance characteristics in decreasing the power noise occurred in a 3D package.
引用
收藏
页码:32 / 35
页数:4
相关论文
共 6 条
[1]  
Khan MAR, 2012, INT CONF COMPUT INFO, P305, DOI 10.1109/ICCITechn.2012.6509769
[2]   A Bidirectional Inductive Power Interface for Electric Vehicles in V2G Systems [J].
Madawala, Udaya K. ;
Thrimawithana, Duleepa J. .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2011, 58 (10) :4789-4796
[3]   A 195-Gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package [J].
Miura, N ;
Mizoguchi, D ;
Inoue, M ;
Sakurai, T ;
Kuroda, T .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2006, 41 (01) :23-34
[4]   Inductive Power Link for a Wireless Cortical Implant With Two-Body Packaging [J].
Silay, Kanber Mithat ;
Dehollain, Catherine ;
Declercq, Michel .
IEEE SENSORS JOURNAL, 2011, 11 (11) :2825-2833
[5]  
Song E, 2013, ASIA-PAC INT SYM ELE
[6]   Design and analysis of an adaptive transcutaneous power telemetry for biomedical implants [J].
Wang, GX ;
Liu, WT ;
Sivaprakasam, M ;
Kendir, GA .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2005, 52 (10) :2109-2117