Study on microstructure and its correlation with sheet resistance of Zn-Al metallized film

被引:4
作者
Yang, Ying [1 ,2 ]
Huang, He [1 ,2 ]
Wang, Fang [1 ,2 ]
Zheng, Jun [1 ,2 ]
Wang, Jinbing [3 ]
Tang, Zebo [3 ]
Zhou, Feng [3 ]
Chen, Mohan [4 ]
Wang, Qimin [1 ,2 ]
机构
[1] Anhui Univ Technol, Key Lab Green Fabricat & Surface Technol Adv Met, Minist Educ, Maanshan 243002, Peoples R China
[2] Anhui Univ Technol, Res Ctr Modern Surface & Interface Engn, Maanshan 243002, Peoples R China
[3] Anhui Saifu Elect CO LTD, Tongling, Peoples R China
[4] Pusan Natl Univ, Sch Mat Sci & Engn, Busan, South Korea
关键词
Metallized film capacitor; Zn-Al metallized film; thermal evaporation; microstructure; sheet resistance; THIN-FILMS; DEGRADATION;
D O I
10.1080/02670844.2021.1918933
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Zn-Al film was prepared on biaxially oriented polypropylene (BOPP) substrate via vacuum thermal evaporation. The microstructure and its correlation with sheet resistance of Zn-Al film were explored systematically. The results showed that the macromorphology of Zn-Al film was closely related to the surface topography of BOPP substrate. XRD and SEM analysis indicated that Zn-Al film displayed a columnar and strong textured structure of Zn (002). TEM results revealed that the film thickness was in the range of 20-25 nm, of which amorphous alumina was identified on/at the surface and interface, while Zn and a small amount of ZnO were detected in the middle. The amorphous alumina on the film surface prevented the further oxidation of Zn, and therefore helped to improve the stability of sheet resistance of the film. Nevertheless, the insulative alumina significantly decreased the film conductivity, which deteriorated the current handling ability of metallized film capacitors.
引用
收藏
页码:1051 / 1058
页数:8
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