Improvement on defect detection performance of PCB inspection based on ECT technique with multi-SV-GMR sensor

被引:11
作者
Chomsuwan, K. [1 ]
Yamada, S.
Iwahara, M.
机构
[1] Kanazawa Univ, Inst Nat & Environm Technol, Kanazawa, Ishikawa 9201192, Japan
[2] King Mongkuts Univ Technol, Dept Elect Technol Educ, Bangkok 10140, Thailand
关键词
eddy-current testing (ECT); multisensor; printed circuit board (PCB); scanning speed; signal averaging; signal-to-noise ratio (SNR); spin-valve giant magnetoresistance (SV-GMR);
D O I
10.1109/TMAG.2007.893480
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes the improvement on the defect detection performance of printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique with the multispin-valve giant magnetoresistance (SV-GMR) sensor. To obtain the ECT signal in the same scanning line, SV-GMR sensors are mounted on the exciting coil in the same column parallel with the scanning direction. Harmonic analysis based on the Fourier transform is used to analyze the signal from the SV-GMR sensor in order to increase scanning speed. Then signal averaging is applied to the ECT signal in order to improve the signal-to-noise ratio. Experimental results are performed to verify the inspection performance.
引用
收藏
页码:2394 / 2396
页数:3
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