Fracture mechanics and crack contact analyses of the active repair of multi-layered piezoelectric patches bonded on cracked structures

In this paper, two-dimensional plane strain finite element analyses of the active repair for cracked structures by using multi-layered piezoelectric patches have been studied. The reductions of stress intensity factors and strain energy density factor at the crack tips are obtained. Also, the repair voltages for various conditions are obtained for estimating the repair performances. Lower repair voltage is a better choice because it is low-energy-consuming and safer for the operation. From the results of numerical fracture mechanics, it shows the crack contact conditions must be considered in the analysis. However, the friction on the crack has few effects on the repair performances for this mode-I dominated case. The better design choices for the piezoelectric patch are as follows: increasing the layer number, increasing the patch length, and reducing the patch thickness. In additions, it is not a good idea to use higher input voltage that is larger than the repair voltage because it will enlarge the crack open hear the crack tip. Too long patch length has no advantage for the active repair. (c) 2006 Elsevier Ltd. All rights reserved.